Tungsten coatings were deposited on silicon substrates by radio frequency (rf) magnetron sputtering from a metallic target in Ar atmosphere. The process parameters during the sputtering process were evaluated by a Langmuir probe, particularly, the electron density and electron temperature were measured by changing the rf power and gas pressure. The morphological and structural properties of the coatings were studied as a function of the pressure. Significant correlations were found between process parameters and characteristics properties of W coatings. The influence of deposition parameters on electrical properties was investigated. The electrical resistivity of the coatings was increased from 1.3 × 10-6 to 3 × 10-5 ? m as the pressure increased as well.
Study of process parameters and characteristics properties of W coatings deposited by rf plasma sputtering
Vassallo E.; Pedroni M.; Aloisio M.; Minelli D.; Nardone A.; Chen H.; Pietralunga S.M.; Stinchelli A.; Di Fonzo F.
ID | 481054 |
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DOI | 10.1116/6.0002377 |
PRODUCT TYPE | Journal Article |
LAST UPDATE | 2023-06-19T11:34:05Z |